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Cover Electronic Failure Analysis Handbook : Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies
by Perry L. Martin

Hardcover - 750 pages (February 1999)
McGraw Hill Text
ISBN: 0070410445
Dimensions (in inches): 2.16 x 9.49 x 7.69

Book Description
Broad coverage of the entire industry: will appeal to both electronic designers and reliability specialists. Each chapter features cast studies illustrating the practices covered. Range of components covered from microelectronics to wires and cables.

From the Back Cover
The definitive, all-in-one, cost-saving guide to electronic failure analysis--from the field's top experts. Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here--in one complete, comprehensive source. In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance. Absolutely essential to anyone concerned with electronic product development and testing, the Electronic Failure Analysis Handbook gives you ready-to-use, insider information on: state-of-the-art EFA techniques; the how's and why's of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.

The author, Perry L. Martin, 2/8/99 , February 8, 1999
Yes, I admit it, I'm proud to say; "I work with failures!"
Throughout the school years, Scientists and Engineers are taught how and why things work. In my experience it is rare to ever get more than a short anecdote about the failures(why things don't work), yet this is where the real learning, the growth, occurs. People learn by making mistakes and taking corrective actions so that the same mistakes will not be made again. We say that people mature. Manufacturing processes can mature in a similar manner. The semiconductor/microelectronics industry embraced this philosophy and incorporated microelectronic failure analysis into the corporate culture. The result was miraculous increases in product reliability. The achievements of the microelectronics industry were admired by other electronics-related companies and, to some extent, duplicated. Electronic failure analysis is now common across a broad range of companies and electronics technologies yet it is difficult to find any documentation of these efforts. The Electronic Failure Analysis Handbook is an attempt to address this deficiency. The Electronic Failure Analysis Handbook is presented in three parts:

Part One is the shortest and deals with the uses of electronic failure analysis (EFA). Background on system and component reliability is presented, as well as an entire chapter on the use of EFA in product liability.

Part Two deals with the techniques involved in performing EFA. Techniques include: electrical charaterization, x-ray, IR-thermography, acoustic micro-imaging, photography, metallography, etc.. Efforts are made to present information to allow optimization of these techniques for specific technologies.

Part Three deals with the failure analysis of specific technologies. This includes: Microelectronics, passive components, connectors, solder joints, switches, high-voltage applications, etc.. The intent is to be as inclusive as possible. I would not attempt to develop such a comprehensive undertaking alone. I called upon the leading experts in their fields to contribute chapters to the handbook and case studies & examples are presented and featured in all three parts of the handbook. These experts did a wonderful job of presenting the material in a useful format. I believe that this handbook will be a valuable addition to the library of anyone who works in or around electronics. I sincerely hope that it serves you well.

Cover Electronic Component Reliability : Fundamentals, Modelling, Evaluation, and Assurance (Wiley Series in Quality and Reliability Engineering)
by Finn Jensen

Paperback - 374 pages (March 1996)
John Wiley & Sons
ISBN: 0471952966
Dimensions (in inches): 1.08 x 9.83 x 6.78

The publisher, John Wiley & Sons
Using a unique approach, the author examines both reliability physics and reliability statistics to reveal how they can be employed in order to discover why components fail and how failures develop over time. The text introduces several important reliability concepts and then divides into three key areas--modelling, evaluation and assurance.

Booknews, Inc. , August 1, 1996
Details current approaches to component reliability evaluation and assurance and highlights developing techniques, emphasizing the underlying causes of failure. Coverage includes fundamental topics such as statistical distributions; modeling aspects such as intrinsic and extrinsic reliability; evaluation issues including field failure data analysis; and assurance topics such as reliability indicator screening. Contains 10 reference appendices. For engineers applying reliability principles in component design, manufacture, testing, and field service. Annotation c. by Book News, Inc., Portland, Or.

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